Title :
Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)
Abstract :
The following topics were dealt with: failure analysis techniques; dielectrics; packaging; metallisation; EOS; ESD; building-in reliability; hot carrier stress
Keywords :
electrostatic discharge; failure analysis; hot carriers; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; EOS; ESD; building-in reliability; dielectrics; failure analysis; hot carrier stress; integrated circuits; metallisation; packaging; physical analysis;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
0-7803-6675-1
DOI :
10.1109/IPFA.2001.941449
