• DocumentCode
    3350024
  • Title

    An Experimental Investigation of Miniature Loop Heat Pipe with Flat Evaporator

  • Author

    Gai, Dongxing ; Liu, Wei ; Liu, Zhichun ; Yang, Jinguo

  • Author_Institution
    Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2009
  • fDate
    27-31 March 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper specifically addresses the thermal characteristics of the miniature loop heat pipe (mLHP) with flat disk shaped evaporator for the thermal control of the compact electronic devices. The loop was made of stainless steel with sintered nickel wick and ammonia as the working fluid. Detail study was conducted on the start-up reliability of the mLHP and the operating characteristics under different heat loads. In the horizontal orientation, the device was able to transfer maximum heat-flux of 7W/cm2 with evaporator temperature below 55degC limit. The experiments conformed that the mLHP could achieve steady state in very short time and adapt the different heat-flux loads very well. The effect of the sink temperature was studied in detail, and decrease of the sink temperature was useful to the start-up of the mLHP but useless to decrease the temperature of the evaporator wall.
  • Keywords
    ammonia; discs (structures); heat pipes; heat sinks; nickel; reliability; stainless steel; temperature control; ammonia; compact electronic devices; flat disk shaped evaporator; heat-flux loads; miniature loop heat pipe; sink temperature; sintered nickel wick; stainless steel; start-up reliability; thermal control; Aerospace electronics; Heat engines; Heat pumps; Heat transfer; Nickel; Space technology; Steady-state; Steel; Temperature control; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference, 2009. APPEEC 2009. Asia-Pacific
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-2486-3
  • Electronic_ISBN
    978-1-4244-2487-0
  • Type

    conf

  • DOI
    10.1109/APPEEC.2009.4918135
  • Filename
    4918135