Title :
The reactive ion etcher as a physical and failure analysis tool for FC-PGA packages
Author_Institution :
Dept. of Quality & Reliability, Intel Technol. Sdn. Bhd., Penang, Malaysia
Abstract :
Failure analysis of integrated circuit packages often requires the selective removal of material such as solder resists, ink swap and more importantly package substrate material. Although mechanical sample preparation has been useful in some cases, it lacks the selectivity needed to precisely control the degree of removal. Reactive ion etching (RIE) has been used during the organic land grid array (OLGA) FA activities for removing package substrate. However, during the development stage of flip chip pin grid array (FCPGA) packaging, the use of RIE faced some difficulty. Further development reveals that package differences such as the addition of pins and larger form factor has caused the proliferation of the usage of RIE from OLGA to FCPGA to be slightly complicated
Keywords :
failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; plasma materials processing; resists; soldering; specimen preparation; sputter etching; FC-PGA packages; FCPGA packaging; OLGA FA; RIE; failure analysis; failure analysis tool; flip chip pin grid array packaging; form factor; ink swap; integrated circuit packages; mechanical sample preparation; organic land grid array; package pin addition; package substrate material; package substrate removal; physical analysis tool; reactive ion etcher; reactive ion etching; selective material removal; selectivity; solder resists; Chemicals; Electrodes; Etching; Failure analysis; Integrated circuit packaging; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma transport processes; Semiconductor device packaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the
Print_ISBN :
0-7803-6675-1
DOI :
10.1109/IPFA.2001.941475
