DocumentCode :
3350525
Title :
Molecular simulations of sliding process between Fe and DLC films on various boundary conditions
Author :
Huiqing Lan ; Can Liu ; Yue Cui ; Kato, Toshihiko
Author_Institution :
Sch. of Mech., Electron. & Control Eng., Beijing Jiaotong Univ., Beijing, China
Volume :
4
fYear :
2011
fDate :
26-28 July 2011
Firstpage :
2147
Lastpage :
2150
Abstract :
Diamond-like carbon (DLC) films have been extensively studied over the past decades due to their unique combination of properties, such as a low friction coefficient, high hardness, high wear resistance and chemical inertness. But many results of DLC films exhibit a wide range of sometimes contradictory tribological properties. In the experiment, isolating the influences of factors, such as film structure, testing conditions and environments effects has proven different. In the paper, molecular dynamics (MD) simulations were used to study a sliding friction process between Fe and DLC films on various boundary conditions (such as: water, oil and no lubrication). The results have been shown that for all the boundary conditions, boundary lubrication occurs, even where there is no lubricant between the Fe and DLC films. The Lubrication boundaries have little effect on the tribological properties between Fe and DLC films. The friction forces for all the cases are almost the same.
Keywords :
diamond-like carbon; hardness; iron; lubrication; metallic thin films; molecular dynamics method; sliding friction; wear resistance; C; DLC films; Fe; boundary conditions; chemical inertness; friction coefficient; hardness; molecular dynamics simulation; sliding friction process; wear resistance; Coatings; Diamond-like carbon; Films; Friction; Iron; Lubricants; Lubrication; diamond-like carbon (DLC) films; lubrication; molecular dynamics (MD); sliding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Natural Computation (ICNC), 2011 Seventh International Conference on
Conference_Location :
Shanghai
ISSN :
2157-9555
Print_ISBN :
978-1-4244-9950-2
Type :
conf
DOI :
10.1109/ICNC.2011.6022602
Filename :
6022602
Link To Document :
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