• DocumentCode
    3350525
  • Title

    Molecular simulations of sliding process between Fe and DLC films on various boundary conditions

  • Author

    Huiqing Lan ; Can Liu ; Yue Cui ; Kato, Toshihiko

  • Author_Institution
    Sch. of Mech., Electron. & Control Eng., Beijing Jiaotong Univ., Beijing, China
  • Volume
    4
  • fYear
    2011
  • fDate
    26-28 July 2011
  • Firstpage
    2147
  • Lastpage
    2150
  • Abstract
    Diamond-like carbon (DLC) films have been extensively studied over the past decades due to their unique combination of properties, such as a low friction coefficient, high hardness, high wear resistance and chemical inertness. But many results of DLC films exhibit a wide range of sometimes contradictory tribological properties. In the experiment, isolating the influences of factors, such as film structure, testing conditions and environments effects has proven different. In the paper, molecular dynamics (MD) simulations were used to study a sliding friction process between Fe and DLC films on various boundary conditions (such as: water, oil and no lubrication). The results have been shown that for all the boundary conditions, boundary lubrication occurs, even where there is no lubricant between the Fe and DLC films. The Lubrication boundaries have little effect on the tribological properties between Fe and DLC films. The friction forces for all the cases are almost the same.
  • Keywords
    diamond-like carbon; hardness; iron; lubrication; metallic thin films; molecular dynamics method; sliding friction; wear resistance; C; DLC films; Fe; boundary conditions; chemical inertness; friction coefficient; hardness; molecular dynamics simulation; sliding friction process; wear resistance; Coatings; Diamond-like carbon; Films; Friction; Iron; Lubricants; Lubrication; diamond-like carbon (DLC) films; lubrication; molecular dynamics (MD); sliding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Natural Computation (ICNC), 2011 Seventh International Conference on
  • Conference_Location
    Shanghai
  • ISSN
    2157-9555
  • Print_ISBN
    978-1-4244-9950-2
  • Type

    conf

  • DOI
    10.1109/ICNC.2011.6022602
  • Filename
    6022602