Short failure analysis under fault isolation

Author

Mai, Z.H. ; Palaniappan, M. ; Chin, J.M. ; Soh, C.E. ; Knauss, L.A. ; Fleet, E.F.

Author_Institution

Device Analysis Lab., Adv. Micro Devices (Singapore) Pte. Ltd., Singapore

fYear

2001

fDate

2001

Firstpage

202

Lastpage

205

Abstract

Scanning superconducting quantum interference device (SQUID) microscopy, along with real time X-ray (RTX) microscopy and scanning acoustic microscopy (SAM), was used as a fault isolation tool for IC short circuit failure analysis. Fault isolation was carried out before physical analysis. Experimental procedures and results for both fault isolation and physical analysis are given in detail

Keywords

SQUIDs; X-ray microscopy; acoustic microscopy; failure analysis; fault location; integrated circuit reliability; integrated circuit testing; IC short circuit failure analysis; RTX microscopy; fault isolation; fault isolation tool; physical analysis; real time X-ray microscopy; scanning SQUID microscopy; scanning acoustic microscopy; scanning superconducting quantum interference device microscopy; short failure analysis; Circuit faults; Educational institutions; Failure analysis; Integrated circuit packaging; Interference; Magnetic analysis; Magnetic sensors; Microscopy; SQUIDs; Superconducting devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the

Print_ISBN

0-7803-6675-1

Type

conf

DOI

10.1109/IPFA.2001.941486

Filename

941486