Title :
Pre-design ASIC device evaluation
Author :
Pomerantz, Allen J.
Author_Institution :
Toshiba America Electronic Components Inc., Sunnyvale, CA, USA
Abstract :
With ASIC product technology and package selection becoming increasingly more complex, many design factors such as gate complexity, critical path performance, power dissipation, I/O drive capability, device interface noise and other design related factors need to be considered when evaluating ASIC device process technology, product implementation, and package selection
Keywords :
application specific integrated circuits; integrated circuit technology; logic design; packaging; ASIC product technology; I/O drive capability; critical path performance; design factors; device interface noise; device process technology; gate complexity; package selection; power dissipation; product implementation; Application specific integrated circuits; Electronic components; Logic arrays; Logic design; Logic devices; Microelectronics; Packaging; Power engineering and energy; Read only memory; Wiring;
Conference_Titel :
ASIC Conference and Exhibit, 1991. Proceedings., Fourth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-0101-3
DOI :
10.1109/ASIC.1991.242970
