Title :
Results from the first prototype of large 3D active edge sensors
Author :
Kok, Angela ; Boscardin, M. ; Betta, G-F Dalla ; Da Via, C. ; Darbo, G. ; Fleta, C. ; Hansen, T.-E. ; Hasi, J. ; Kenney, C. ; Lietaer, N. ; Lozano, M. ; Parker, S.I. ; Pellegrini, G.. ; Summanwar, A.
Author_Institution :
MiNaLab, SINTEF, Oslo, Norway
Abstract :
3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.
Keywords :
radiation effects; readout electronics; semiconductor counters; sputter etching; wafer bonding; 3D active edge sensors; ATLAS FE-I4 readout electronics; SINTEF MiNaLab; deep reactive ion etching; edgeless capability; radiation hardness; size 18.5 mm; size 20.5 mm; wafer bonding; Bonding; Detectors; Image edge detection; Nuclear measurements; Three dimensional displays;
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2011 IEEE
Conference_Location :
Valencia
Print_ISBN :
978-1-4673-0118-3
DOI :
10.1109/NSSMIC.2011.6154334
