DocumentCode :
3352407
Title :
Advanced SRAM technology-the race between 4T and 6T cells
Author :
Lage, C. ; Hayden, J.D. ; Subramanian, C.
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
fYear :
1996
fDate :
8-11 Dec. 1996
Firstpage :
271
Lastpage :
274
Abstract :
This work discusses the trade-offs between 4T SRAM cells which use four bulk transistors (and have poly resistor or TFT loads) and 6T SRAM cells which use six bulk transistors (and use bulk PMOS loads). 4T SRAM cells have dominated the stand-alone SRAM market since first introduced in the 1970´s, but 6T SRAM cells have been dominant for on-chip storage in advanced microprocessors and other logic circuits. However, recently there has been a resurgence of interest in 6T cells for stand alone SRAM applications. While 4T cells are typically smaller, they generally require a more complex process, and have poorer stability, especially at low voltage. This paper quantitatively examines several different trade-offs in SRAM cell design.
Keywords :
CMOS memory circuits; SRAM chips; circuit stability; integrated circuit design; memory architecture; 4T SRAM cells; 6T SRAM cells; CMOS process; SRAM technology; TFT loads; bulk PMOS loads; bulk transistors; on-chip storage; poly resistor; process commonality; process complexity; stability; stand alone SRAM applications; trade-offs; Circuit stability; Costs; Laboratories; Logic circuits; Low voltage; Microprocessors; Random access memory; Research and development; Resistors; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1996. IEDM '96., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-3393-4
Type :
conf
DOI :
10.1109/IEDM.1996.553582
Filename :
553582
Link To Document :
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