Q-TAT production and CIM systems for the packaging process within IC fabrication

Author

Iwasaki, Noriki ; Shimosato, Yoshinobu ; Tamiguchi, Kiyomi ; Shimano, Kiyoharu

Author_Institution

Production Eng. Dept., Sharp Corp., Nara, Japan

fYear

1995

fDate

17-19 Sep 1995

Firstpage

14

Lastpage

17

Abstract

The time required for the processes from die bonding through molding could be reduced to less than half a day by introducing improved production systems, new processes, and the CIM system. Thus, a CIM line capable of flexible small-lot production of multiple product variations could be constructed. In addition, the time required for input to the packaging process through packing was reduced to half that of the conventional system, thus achieving a QTAT line. Productivity was also enhanced to 1.5 times that of the conventional system

Keywords

computer integrated manufacturing; flexible manufacturing systems; human resource management; integrated circuit manufacture; integrated circuit packaging; CIM systems; IC fabrication; Q-TAT production; flexible small-lot production; multiple product variations; packaging process; production systems; productivity; Automatic control; Automation; Computer integrated manufacturing; Curing; Fabrication; Lead; Microassembly; Packaging; Production equipment; Production systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on

Conference_Location

Austin, TX

Print_ISBN

0-7803-2928-7

Type

conf

DOI

10.1109/ISSM.1995.524349

Filename

524349