Title :
A multi-pronged approach to defect management
Author :
Paradis, D.E. ; Guldi, R.L. ; Lalena, J.N. ; Ritchison, J.W.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
This paper describes a comprehensive, three pronged approach to defect management combining the elements of continuous in-line monitoring, yield loss quantification, and short loop analysis. In-line monitoring provides both a historical defect baseline and a trigger for initiating corrective action in the event of out-of-control situations. Yield loss quantification involving conventional bit mapping or bin mapping partitions the yield loss by defect type and process level. Loop monitors relate trouble spots to root causes, providing a continuous measure of the progress of process and equipment improvement programs
Keywords :
inspection; integrated circuit manufacture; integrated circuit yield; bin mapping; bit mapping; continuous in-line monitoring; defect management; integrated circuit manufacturing; short loop analysis; yield loss quantification; Design optimization; Inspection; Instruments; Management training; Manufacturing; Monitoring; Probes; Production; Software maintenance; Testing;
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
DOI :
10.1109/ISSM.1995.524363