• DocumentCode
    3352848
  • Title

    Evaluation and control method of organic contamination on wafer surfaces

  • Author

    Saito, Misako

  • Author_Institution
    Process Technol. Center, Tokyo Electron. Inc., Yamanashi, Japan
  • fYear
    1995
  • fDate
    17-19 Sep 1995
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    Organic contamination on wafers can be reduced by at least 50% by storing the wafers in a local space isolated from the clean room atmosphere. However, some components of the local space might cause wafer contamination due to degassing. It is thus necessary to select components with less degassing and to adopt a suitable method for component evaluation. A component evaluation method using the wafer as adsorbent is introduced, which is advantageous in that it detects the contaminants on the wafer only
  • Keywords
    chemical variables measurement; chromatography; clean rooms; integrated circuit technology; organic compounds; surface contamination; thermally stimulated desorption; clean room atmosphere; component evaluation method; contamination control; degassing; local space storage; organic contamination; wafer adsorbent; wafer surfaces; Atmosphere; Containers; Filters; Organic chemicals; Organic materials; Paints; Semiconductor device manufacture; Surface cleaning; Surface contamination; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-2928-7
  • Type

    conf

  • DOI
    10.1109/ISSM.1995.524383
  • Filename
    524383