DocumentCode
3352848
Title
Evaluation and control method of organic contamination on wafer surfaces
Author
Saito, Misako
Author_Institution
Process Technol. Center, Tokyo Electron. Inc., Yamanashi, Japan
fYear
1995
fDate
17-19 Sep 1995
Firstpage
171
Lastpage
174
Abstract
Organic contamination on wafers can be reduced by at least 50% by storing the wafers in a local space isolated from the clean room atmosphere. However, some components of the local space might cause wafer contamination due to degassing. It is thus necessary to select components with less degassing and to adopt a suitable method for component evaluation. A component evaluation method using the wafer as adsorbent is introduced, which is advantageous in that it detects the contaminants on the wafer only
Keywords
chemical variables measurement; chromatography; clean rooms; integrated circuit technology; organic compounds; surface contamination; thermally stimulated desorption; clean room atmosphere; component evaluation method; contamination control; degassing; local space storage; organic contamination; wafer adsorbent; wafer surfaces; Atmosphere; Containers; Filters; Organic chemicals; Organic materials; Paints; Semiconductor device manufacture; Surface cleaning; Surface contamination; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location
Austin, TX
Print_ISBN
0-7803-2928-7
Type
conf
DOI
10.1109/ISSM.1995.524383
Filename
524383
Link To Document