Title :
Evaluation and control method of organic contamination on wafer surfaces
Author_Institution :
Process Technol. Center, Tokyo Electron. Inc., Yamanashi, Japan
Abstract :
Organic contamination on wafers can be reduced by at least 50% by storing the wafers in a local space isolated from the clean room atmosphere. However, some components of the local space might cause wafer contamination due to degassing. It is thus necessary to select components with less degassing and to adopt a suitable method for component evaluation. A component evaluation method using the wafer as adsorbent is introduced, which is advantageous in that it detects the contaminants on the wafer only
Keywords :
chemical variables measurement; chromatography; clean rooms; integrated circuit technology; organic compounds; surface contamination; thermally stimulated desorption; clean room atmosphere; component evaluation method; contamination control; degassing; local space storage; organic contamination; wafer adsorbent; wafer surfaces; Atmosphere; Containers; Filters; Organic chemicals; Organic materials; Paints; Semiconductor device manufacture; Surface cleaning; Surface contamination; Thermal degradation;
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
DOI :
10.1109/ISSM.1995.524383