DocumentCode
3353116
Title
Radiation tolerant IP Cores for the control and readout of Front-End electronics in High Energy Physics experiments
Author
Bianchi, G. ; Costantino, N. ; Fanucci, L. ; Incandela, J. ; Magazzù, G. ; Tongiani, C. ; Saponara, S.
Author_Institution
Dept. of Phys., Univ. of California Santa Barbara, Santa Barbara, CA, USA
fYear
2011
fDate
23-29 Oct. 2011
Firstpage
2124
Lastpage
2127
Abstract
In future HEP experiments the increased luminosity and the need of higher detector performance will push toward severe requirements on radiation hardness and power dissipation of hardware components. The use of “standard” and flexible protocols, modular architectures and IP-cores available to ASIC and FPGA designers will contribute to meet these requirements, while keeping development and production costs under control. The goal of the FF-LYNX project is the definition of a flexible protocol that allows the use of the same physical serial links and interfaces for the transmission of Timing, Trigger and Control (TTC) signals and Data Acquisition (DAQ). The protocol has been implemented in TX and RX interfaces based on serial electrical links designed as IP Cores. A test chip has been fabricated in the IBM 130nm CMOS technology. The architecture of the test interface and of the test chip will be presented together with preliminary results on area, speed and power consumption. Also the performance in terms of total ionization dose rad-tolerance will be reported.
Keywords
CMOS integrated circuits; data acquisition; microprocessor chips; nuclear electronics; particle beam focusing; radiation hardening (electronics); readout electronics; timing circuits; trigger circuits; ASIC designer; CMOS technology; FF-LYNX project; FPGA designer; RX interface; TX interface; control front-end electronics; data acquisition; flexible protocol; hardware component; high energy physics experiment; ionization dose rad-tolerance; power consumption; power dissipation; radiation hardness; radiation tolerant IP core; readout front-end electronics; test chip; test chip fabrication; test interface architecture; timing signal transmission; transmission control signal; trigger signal transmission; Annealing; CMOS integrated circuits; CMOS technology; Indexes; Monitoring; Protocols; Robustness; High Energy Physics (HEP) experiments; integrated circuits (ICs) Intellectual property (IP) core; radiation tolerance; serial communications;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2011 IEEE
Conference_Location
Valencia
ISSN
1082-3654
Print_ISBN
978-1-4673-0118-3
Type
conf
DOI
10.1109/NSSMIC.2011.6154432
Filename
6154432
Link To Document