• DocumentCode
    3353116
  • Title

    Radiation tolerant IP Cores for the control and readout of Front-End electronics in High Energy Physics experiments

  • Author

    Bianchi, G. ; Costantino, N. ; Fanucci, L. ; Incandela, J. ; Magazzù, G. ; Tongiani, C. ; Saponara, S.

  • Author_Institution
    Dept. of Phys., Univ. of California Santa Barbara, Santa Barbara, CA, USA
  • fYear
    2011
  • fDate
    23-29 Oct. 2011
  • Firstpage
    2124
  • Lastpage
    2127
  • Abstract
    In future HEP experiments the increased luminosity and the need of higher detector performance will push toward severe requirements on radiation hardness and power dissipation of hardware components. The use of “standard” and flexible protocols, modular architectures and IP-cores available to ASIC and FPGA designers will contribute to meet these requirements, while keeping development and production costs under control. The goal of the FF-LYNX project is the definition of a flexible protocol that allows the use of the same physical serial links and interfaces for the transmission of Timing, Trigger and Control (TTC) signals and Data Acquisition (DAQ). The protocol has been implemented in TX and RX interfaces based on serial electrical links designed as IP Cores. A test chip has been fabricated in the IBM 130nm CMOS technology. The architecture of the test interface and of the test chip will be presented together with preliminary results on area, speed and power consumption. Also the performance in terms of total ionization dose rad-tolerance will be reported.
  • Keywords
    CMOS integrated circuits; data acquisition; microprocessor chips; nuclear electronics; particle beam focusing; radiation hardening (electronics); readout electronics; timing circuits; trigger circuits; ASIC designer; CMOS technology; FF-LYNX project; FPGA designer; RX interface; TX interface; control front-end electronics; data acquisition; flexible protocol; hardware component; high energy physics experiment; ionization dose rad-tolerance; power consumption; power dissipation; radiation hardness; radiation tolerant IP core; readout front-end electronics; test chip; test chip fabrication; test interface architecture; timing signal transmission; transmission control signal; trigger signal transmission; Annealing; CMOS integrated circuits; CMOS technology; Indexes; Monitoring; Protocols; Robustness; High Energy Physics (HEP) experiments; integrated circuits (ICs) Intellectual property (IP) core; radiation tolerance; serial communications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2011 IEEE
  • Conference_Location
    Valencia
  • ISSN
    1082-3654
  • Print_ISBN
    978-1-4673-0118-3
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2011.6154432
  • Filename
    6154432