DocumentCode :
3353178
Title :
A CMOS Readout IC Design for Uncooled Infrared Bolometer Image Sensor Application
Author :
Hwang, Sang Joon ; Shin, Aram ; Shin, Ho Hyun ; Sung, Man Young
Author_Institution :
Dept. of Electr. Eng., Korea Univ.
Volume :
4
fYear :
2006
fDate :
9-13 July 2006
Firstpage :
2788
Lastpage :
2791
Abstract :
As infrared light is radiated, the CMOS readout IC (ROIC) for the microbolometer type infrared sensor detects voltage or current when the resistance value in the bolometer sensor varies. One of the serious problems in designing the ROIC is that resistances in the bolometer and replica resistor have process variation. This means that each pixel does not have the same resistance, causing serious fixed pattern noise problems in sensor operations. In this paper, differential input stage readout architecture is suggested for bias offset reduction, noise immunity and high sensing margin. In addition, using this scheme the effects of a process variation problem and various other bias heating noise problems, are reduced. In this paper, a prototype ROICs, intended for uncooled microbolometer infrared focal plane array, is designed and fabricated. The proposed architecture is demonstrated by fabrication of a prototype consisting of 32 times 32 pixels fabricated in a 0.25-mum CMOS process
Keywords :
CMOS image sensors; bolometers; focal planes; microsensors; optical sensors; readout electronics; CMOS readout IC design; bias offset reduction; focal plane array; noise immunity; pattern noise problems; process variation; replica resistor; uncooled infrared microbolometer image sensor application; Application specific integrated circuits; Bolometers; CMOS image sensors; CMOS integrated circuits; Infrared detectors; Infrared image sensors; Infrared sensors; Noise reduction; Prototypes; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2006 IEEE International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-0496-7
Electronic_ISBN :
1-4244-0497-5
Type :
conf
DOI :
10.1109/ISIE.2006.296056
Filename :
4078832
Link To Document :
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