DocumentCode
3353214
Title
Low cost production by simplified processing
Author
Ohmi, Tadahiro
Author_Institution
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
fYear
1995
fDate
17-19 Sep 1995
Firstpage
277
Lastpage
282
Abstract
High throughput and low cost production with 100% yield is strictly demanded for ULSI manufacturing, where a decrease of minimum feature size of devices and an increase of wafer diameter is continuously enhanced for the future. It is realized by simplified processing due to a simplified device structure by introducing new concepts of devices and new materials to Si technology. Simplification of manufacturing processes becomes possible based on a full understanding of process mechanisms in a scientific manner, resulting in a dramatic reduction of process steps
Keywords
ULSI; integrated circuit technology; surface cleaning; Si; Si technology; ULSI manufacturing; feature size; low cost production; processing; surface cleaning; throughput; wafer diameter; yield; Argon; Chemical processes; Costs; Manufacturing processes; Moisture; Production; Semiconductor device manufacture; Surface cleaning; Surface contamination; Water pollution;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location
Austin, TX
Print_ISBN
0-7803-2928-7
Type
conf
DOI
10.1109/ISSM.1995.524407
Filename
524407
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