• DocumentCode
    3353377
  • Title

    Tensile test of notched metal film by means of thermal expansion of plastics

  • Author

    Tada, Naoya ; Shimizu, Ichiro ; Uemori, Kazumasa

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama
  • fYear
    2007
  • fDate
    19-22 Nov. 2007
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Tensile tests of notched thin film of pure titanium were carried out on the stage of a digital microscope. Tensile load was generated by the thermal expansion of a pair of polycarbonate loading plates which sandwiched the specimen. Since the thermal expansion coefficient of polycarbonate is much larger than that of pure titanium, the specimen was elongated with an increase in the temperature and successfully fractured at the end of the tensile test. The plastic deformation of the notched part of the specimen was observed during the test and the stress and strain were evaluated. The obtained stress-strain curves were compared with those obtained by a tensile testing device with a piezoelectric stage at the room temperature and 363 K which approximately corresponds to the maximum temperature of the thermal stress-actuated tensile test.
  • Keywords
    metallic thin films; notch testing; plastic deformation; stress-strain relations; tensile testing; thermal expansion; thermal stresses; titanium; Ti; digital microscope; notched metal thin film; piezoelectric stage; plastic deformation; polycarbonate loading plates; pure titanium film; stress-strain curves; temperature 293 K to 298 K; temperature 363 K; thermal expansion coefficient; thermal stress-actuated tensile testing; Capacitive sensors; Microscopy; Plastic films; Temperature; Tensile stress; Testing; Thermal expansion; Thermal loading; Thermal stresses; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
  • Conference_Location
    Daejeon
  • Print_ISBN
    978-1-4244-1909-8
  • Electronic_ISBN
    978-1-4244-1910-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2007.4510292
  • Filename
    4510292