DocumentCode :
3353457
Title :
Geometric and compaction dependence of printed polymer-based RFID tag antenna performance
Author :
Leung, S.Y.Y. ; Lam, D.C.C.
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
fYear :
2007
fDate :
19-22 Nov. 2007
Firstpage :
1
Lastpage :
7
Abstract :
Radio frequency identification (RFIDs) tag with printed antennas are lower in costs, but have lower performance than those with metal antennas. Printed antennas can replace metal ones if the performance is increased without raising cost. The performance of printed antennas can be increased if the series resistance in the antennas is lowered. The resistance is dependent on the line thickness and the resistivity of the conductive ink. Printed antennas with different line thicknesses were fabricated to investigate the effect of compaction and thickness on the resistance. The resistance of the printed antenna coils was decreased by more than 40% after compaction, while the inductance and the parasitic capacitance were unchanged. RFIDs with compacted printed antennas were found to have significantly increased the read range. RFIDs with thick printed antennas were fabricated and tested. These RFIDs were shown to have read ranges comparable to the RFIDs with copper wire antennas. Moreover, a geometry-independent plateau for the read range was found. The presence of a plateau is valuable for thick-line printed antenna design since the plateau will enable the usage of lower precision high volume printing techniques to lower tag fabrication cost.
Keywords :
capacitance; electrical resistivity; inductance; microstrip antennas; radiofrequency identification; antenna series resistance; conductive ink resistivity; inductance capacitance; line thickness; parasitic capacitance; printed polymer-based RFID tag antenna performance; radio frequency identification tag; tag fabrication cost; Coils; Compaction; Conductivity; Costs; Inductance; Ink; Parasitic capacitance; Polymers; RFID tags; Radiofrequency identification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
Type :
conf
DOI :
10.1109/EMAP.2007.4510299
Filename :
4510299
Link To Document :
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