The Reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive

Author

Kim, Byeung-Gee ; Lee, Sang-Mok ; Kim, Young-Ho

Author_Institution

Div. of Mater. Sci. & Eng., Hanyang Univ., Seoul

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

3

Abstract

We developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using non-conductive adhesive (NCA). Sn was used as a bump material because it has a high plastic deformation capability and it is cheaper than an Au bump. Sn bumps were formed using photolithographic and electroplating and reflowed to form the half-dome shape. Reflowed Sn bumps were used to reduce the NCA trapping. COG bonding was performed between the reflowed Sn/Cu bumps on the SiO₂ /Si wafer and ITO/Au/Cu/Ti/ glass substrate at 150degC by using a thermo-compression bonder. The bonded specimens were subjected to reliability test.

Keywords

adhesive bonding; chip scale packaging; electroplating; photolithography; bump material; chip on glass bonding technique; electroplating; non-conductive adhesive; photolithography; Glass; Gold; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Nonconductive adhesives; Sputtering; Testing; Tin; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510304

Filename

4510304