Title :
Effect of surface conditions on interfacial adhesion between PCB and EMC
Author :
Shin, Dongkil ; Han, HyunKyung ; Lee, DongHun ; Song, Younghee ; Im, Jay
Author_Institution :
Div. of Memory, Samsung Electron. Co., Hwasung
Abstract :
Adhesion strength of PCB and EMC interface was investigated. Surface conditions of PCB such as the number of plasma treatment, delay time before EMC molding, and moisture soak time were considered. Adhesion strength was measured by DCB test method. Energy release rate at each crack arresting position was measured. Fracture parameters were studied by numerical simulation. Surface of PCB was analyzed by water contact angle and FT-IR.
Keywords :
Fourier transforms; adhesion; cracks; epoxy insulation; moulding; plasma materials processing; printed circuit testing; surface treatment; PCB; crack arresting position measurement; double cantilever beam test method; epoxy molding compound; interfacial adhesion; moisture soak time; plasma treatment; printed circuit board; surface condition effect; Adhesives; Delay effects; Electromagnetic compatibility; Energy measurement; Moisture; Plasma measurements; Plasma simulation; Surface cracks; Surface treatment; Testing;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510308
