Experimental and numerical investigations of two inline PLCC packages horizontal mounted

Analysis of heat and fluid flow of two PLCC packages mounted in tandem arrangement on a printed circuit board exposed to the free stream velocity is carried out using a commercial CFD code, Fluent. Various approach air velocities are used to emulate the forced convection heat transfer phenomena. Some parametric studies are carried out by varying the package chip power, gap between the packages and air approach velocities. The results are presented in terms of the junction temperature, thermal resistance and top surface average heat transfer coefficient for each package under different operating conditions. The decrease in the junction temperature of the packages with the increase in approach air velocity is clearly observed. Furthermore, the leading edge heat transfer coefficient of the packages is always higher than that at the trailing edge for all approach velocities considered. The results also show that the gap between packages does influence the average heat transfer coefficient and the thermal resistance of the package at a particular approach air velocity.