• DocumentCode
    3353958
  • Title

    High resolution AFM Moiré technique for the detection of defects in nano structure

  • Author

    Park, Jin-Hyoung ; Lee, Soon-Bok

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon
  • fYear
    2007
  • fDate
    19-22 Nov. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Moire interferometry is a useful technique to assess the reliability of electronic package because Moire interferometry can measure the whole-field and real-time deformations. The optical limitation of Moire interferometry makes ambiguous the shear strain of a micro area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the Moire technique. AFM Moire technique is useful to measure the strain of a small area. Also, AFM Moire technique is used to detect of defects in nano structure. In this research, the method to accurately measure the deformation of a small area by using AFM Moire is proposed. A phase-shifting method is applied to improve the resolution of AFM Moire.
  • Keywords
    atomic force microscopy; electronics packaging; interferometry; nanotechnology; AFM Moire technique; Moire interferometry; atomic force microscope; electronic package reliability; nanostructure defect detection; phase-shifting method; Area measurement; Atom optics; Atomic force microscopy; Atomic measurements; Electron optics; Force measurement; Gratings; Optical interferometry; Scanning electron microscopy; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
  • Conference_Location
    Daejeon
  • Print_ISBN
    978-1-4244-1909-8
  • Electronic_ISBN
    978-1-4244-1910-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2007.4510335
  • Filename
    4510335