DocumentCode

3354365

Title

Silicon To Silicon Anodic Bonding Using Evaporated Glass

Author

Krause, P. ; Sporys, M. ; Obermeier, E. ; Lange, K. ; Grigull, S.

Author_Institution

Technical University of Berlin

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

228

Lastpage

231

Keywords

Annealing; Compressive stress; Glass; Hydrogen; Silicon; Solid state circuits; Temperature; Transducers; Wafer bonding; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717151

Filename

717151