Title :
Silicon To Silicon Anodic Bonding Using Evaporated Glass
Author :
Krause, P. ; Sporys, M. ; Obermeier, E. ; Lange, K. ; Grigull, S.
Author_Institution :
Technical University of Berlin
Keywords :
Annealing; Compressive stress; Glass; Hydrogen; Silicon; Solid state circuits; Temperature; Transducers; Wafer bonding; Wet etching;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717151
