• DocumentCode
    3355558
  • Title

    Incorporation of impedance boundary conditions into an advanced, integral equation, full-wave simulator

  • Author

    Cao, Yi ; Zhu, Zhaohui ; Wang, Xing ; Dvorak, Steven L. ; Prince, John L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • fYear
    2005
  • fDate
    31 May-3 June 2005
  • Firstpage
    1560
  • Abstract
    In this paper, we incorporate the surface impedance boundary condition into a MoM-based full-wave layered interconnect simulator (UA-FWLIS) to make it capable of handling conductor losses. By introducing an effective surface current and a surface impedance, the losses on the interconnects can be easily included in UA-FWLIS by adding an extra term to the reaction elements. In addition, the losses on the power/ground planes can also be handled by modifying the Green´s function without affecting the angular integral in the reaction element calculation. Thus, the approach for analytically calculating the integrals in the reaction matrix, which uses readily computable ILHIs and residue theory, is still valid and the efficiency of UA-FWLIS can be retained. Comparing the S-parameter results from UA-FWLIS with those from agilent momentum validates the accuracy of the enhanced UA-FWLIS.
  • Keywords
    Green´s function methods; S-parameters; boundary integral equations; circuit simulation; conductors (electric); losses; method of moments; surface impedance; Green function; ILHI; MoM; S-parameter; UA-FWLIS; conductor loss; full-wave layered interconnect simulator; full-wave simulator; impedance boundary condition; integral equation; power/ground planes; residue theory; surface current; surface impedance; Boundary conditions; Computational modeling; Computer simulation; Conductors; Frequency; Integral equations; Packaging; Surface impedance; Testing; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441996
  • Filename
    1441996