DocumentCode :
3355772
Title :
Embedded decoupling capacitor performance in high speed circuits
Author :
Wan, Lixi ; Raj, P. Markondeya ; Balaraman, Devarajan ; Muthana, Prathap ; Bhattacharya, Swapan K. ; Varadarajan, Mahesh ; Abothu, Isaac Robin ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution :
Center for Packaging Res., Georgia Technol. Inst., Atlanta, GA, USA
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
1617
Abstract :
Embedded decoupling is normally considered a better solution than surface mount decoupling for suppressing the switching noise of a high speed digital board/package because of its shorter leads that result in smaller parasitic inductance. This leads to lower impedance over a higher frequency band. It is presumably better in reliability and lowers the cost as well. Designers tend to use large value capacitors for efficient decoupling. Usually, to increase capacitance of an embedded capacitor, one can use a material with higher dielectric constant, design larger electrodes, and reduce the thickness of the dielectric. However, these strategies may sometimes lead to lower performance at high frequency band. This paper will discuss the pros and cons of different embedded capacitor approaches through simulation. As an application example, a typical power/ground network with an embedded capacitor will be compared with that of surface mount discrete capacitor.
Keywords :
capacitance; capacitors; circuit simulation; dielectric materials; high-speed integrated circuits; inductance; permittivity; printed circuits; surface mount technology; dielectric constant; dielectric material; embedded decoupling capacitor; high frequency band performance; high speed circuits; high speed digital board; high speed digital package; impedance; parasitic inductance; surface mount decoupling; switching noise; Circuit noise; Costs; Dielectric materials; Frequency; High-K gate dielectrics; Inductance; Packaging; Parasitic capacitance; Surface impedance; Switched capacitor circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1442007
Filename :
1442007
Link To Document :
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