DocumentCode :
3355916
Title :
Influence of environmental stresses on board-level integrated polymer optics
Author :
Immonen, Marika ; Wu, Jianbo ; Kivilahti, Jorma
Author_Institution :
Asperation Oy, Aspocomp Perlos Co., Espoo, Finland
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
1653
Abstract :
In this paper, the effects of environmental stresses on the properties of polymer optical waveguides were studied. Multimode step index waveguides were fabricated on printed wiring boards using commercial polymers. The stability of the optical properties of the guide systems was investigated in damp heat-high humidity, high temperature storage, thermal shock and in environmental flowing multigas tests. Aging at high temperature and temperature cycling reduced the refractive index to largest extent. The optical build-up (o-BU) structure in which the optical layer was fabricated on the board surface was observed to be vulnerable under temperature shock when compared with the structure where the optical layer was laminated inside the FR4/Cu boards. The buffer layer beneath the optical build-up was found to improve the stability of the optical waveguides significantly.
Keywords :
integrated circuits; integrated optics; materials testing; optical properties; optical waveguides; polymers; printed circuits; thermal shock; damp heat-high humidity; environmental stress; flowing multigas test; high temperature storage; integrated polymer optics; multimode step index waveguides; optical build-up; polymer optical waveguides; printed wiring boards; refractive index; temperature cycling; thermal shock; Electric shock; Integrated optics; Optical buffering; Optical polymers; Optical refraction; Optical variables control; Optical waveguides; Temperature; Thermal stresses; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1442013
Filename :
1442013
Link To Document :
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