• DocumentCode
    3356989
  • Title

    A new educational curriculum for microelectronic manufacturing engineering program

  • Author

    Yang, D.G.

  • Author_Institution
    Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., China
  • fYear
    2005
  • fDate
    31 May-3 June 2005
  • Firstpage
    1921
  • Abstract
    Electronics manufacturing has become one of the major sectors in manufacturing industry. To meet the demands of the fast developing electronics industry, many well-qualified researchers and engineers are needed. A new interdisciplinary bachelor\´s program named as "microelectronics manufacturing engineering" was setup in 2003 in Guilin University of Electronic Technology (GUET). It is the first time that such a program is offered in China for undergraduates. Much effort is needed to improve the educational curriculum and educational means for the new specialization. This paper proposes an educational curriculum for microelectronic manufacturing engineering program. It explains the need for a formal undergraduate education of engineers in this discipline. The aim, objectives and scope of the educational curriculum is discussed. It is emphasized that the curriculum should cover the majors sectors of electronic manufacturing, with an emphasis on packaging, assembly and quality control. The curriculum structure and the main courses for the program are presented. The laboratory practices, factory practice and design projects related to the program are proposed.
  • Keywords
    educational courses; electronic engineering education; assembly; educational curriculum; electronics manufacturing; microelectronic manufacturing engineering; packaging; quality control; undergraduate education; Assembly; Control engineering education; Educational programs; Electronics industry; Electronics packaging; Industrial electronics; Laboratories; Microelectronics; Pulp manufacturing; Quality control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1442061
  • Filename
    1442061