• DocumentCode
    3358099
  • Title

    Investigation and study of Reverse Engineering and CAD/CAM integration in mold manufacturing

  • Author

    Babu, T. Sudhakar ; Reddy, V.U.B.

  • Author_Institution
    Mech. Eng. Technol. Dept., Yanbu Ind. Coll., Yanbu, Saudi Arabia
  • Volume
    3
  • fYear
    2011
  • fDate
    12-14 Aug. 2011
  • Firstpage
    1115
  • Lastpage
    1118
  • Abstract
    As manufacturers strive to further optimize the development cycles to maintain market competitiveness, the use of reverse engineering technologies have started to play the pivotal role in the product development cycles. Reverse Engineering has become an increasing part of product development process chains resulting in reduced time to market and reduced development costs. Integration of this technology into existing development cycles provides tools to maintain design integrity during development stages as well as between successive product lines. One aspect of Reverse Engineering is the interfacing of data obtained from this technology to various manufacturing processes. This paper discusses about the work carried out at Central Institute of Tool Design to design and manufacture the mold for sculptured part by integrating Reverse Engineering process loop and CADCAM application to optimize the time and cost in real time tool and mold production.
  • Keywords
    CAD/CAM; moulding; product life cycle management; production engineering computing; reverse engineering; CAD-CAM integration; Central Institute of Tool Design; market competitiveness; mold manufacturing; product development cycles; product development process; reverse engineering technologies; Computational modeling; Computer aided manufacturing; Design automation; Reverse engineering; Software; Solid modeling; Surface treatment; CNC machining; Coordinate Measuring Machine; Reverse Engineering; mould design; point cloud data;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
  • Conference_Location
    Harbin, Heilongjiang, China
  • Print_ISBN
    978-1-61284-087-1
  • Type

    conf

  • DOI
    10.1109/EMEIT.2011.6023290
  • Filename
    6023290