Title :
Low cost, thick CZT spectroscopic detectors by sensor-pack construction of multiple tile pieces
Author :
Zhang, Tan ; Du, Yanfeng ; Pan, Feng ; Tkaczyk, J. Eric ; Chen, Henry ; Bindley, Glenn
Author_Institution :
GE Global Res. Center, Niskayuna, NY, USA
Abstract :
Feasibility of a potentially low-cost, large volume radiation detector device is demonstrated. The spectral response performance is mapped per pixel for CZT sensor pack modules build from assemblies of 5mm thick CZT tiles. Device height between 10 and 20mm are compared to modules built with monolithic, 10mm thick parts. Module quality improved over several trials and passing of one year´s time due to improved assembly process and CZT tile quality. A scaling analysis of the yield and cost suggest that tall devices are optimally built from sensor pack tiles. However, as quality of the process improves and defect density decreases there is a cross-over point where the monolithic detector becomes more economical due to a decrease in sidewall preparation process.
Keywords :
II-VI semiconductors; semiconductor counters; semiconductor device manufacture; semiconductor technology; CZT tile quality; cross over point; large volume radiation detector device; low cost CZT spectroscopic detectors; module quality; monolithic detector; multiple tile pieces; scaling analysis; sensor pack construction; sidewall preparation process; size 10 mm to 20 mm; thick CZT spectroscopic detectors; Connectors; Correlation; Detectors; Energy measurement; Energy resolution; Materials; Thickness measurement;
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2011 IEEE
Conference_Location :
Valencia
Print_ISBN :
978-1-4673-0118-3
DOI :
10.1109/NSSMIC.2011.6154725
