• DocumentCode
    3358662
  • Title

    Gold wire stress analysis of wire feed system in automatic wire bonder

  • Author

    Liu, Yuetao ; Liu, Yanjie ; Sun, Lining ; Li, Ji

  • Author_Institution
    State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
  • fYear
    2009
  • fDate
    9-12 Aug. 2009
  • Firstpage
    364
  • Lastpage
    368
  • Abstract
    The wire feed system is an important subsystem of typical automatic wire bonder. The resistance control of wire transmission and tensile force control are the key technologies of the wire feed system, which has a strong impact on the bonding quality. This paper describes the stress analysis of gold wire in the automatic wire bonder. The analysis is useful in the low friction wire feed system and the low resistance transmission. Two stress models of gold wire are developed in the air guide and vacuum tensioner. The relationships between the control parameters of air guide and vacuum tensioner and the stress on gold wire are found out. Results of the experiments of this stress analysis procedure are given to illustrate the proposed models. Emphasis is placed on the construction of the mathematical models of air guide and vacuum tensioner by which the stress of gold wire is evaluated.
  • Keywords
    gold; lead bonding; stress analysis; air guide; automatic wire bonder; bonding quality; gold wire stress analysis; low resistance transmission; mathematical models; resistance control; stress models; tensile force control; vacuum tensioner; wire feed system; wire transmission; Automatic control; Bonding forces; Control systems; Feeds; Force control; Friction; Gold; Stress control; Tensile stress; Wire; air guide; vacuum tensioner; wire bonding wire feed system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation, 2009. ICMA 2009. International Conference on
  • Conference_Location
    Changchun
  • Print_ISBN
    978-1-4244-2692-8
  • Electronic_ISBN
    978-1-4244-2693-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2009.5245980
  • Filename
    5245980