DocumentCode :
3358882
Title :
The ESR characters of unintentionally doped 4H-SiC with Si ion implanted
Author :
Ping Cheng ; Ming Wang ; Lizhi Wang ; YuMing Zhang ; Hui Guo
Author_Institution :
Inf. Eng. Coll., Ningbo Dahongying Univ., Ningbo, China
Volume :
3
fYear :
2011
fDate :
12-14 Aug. 2011
Firstpage :
1340
Lastpage :
1342
Abstract :
The intrinsic defects in epitaxial semi-insulating 4H-SiC that are implanted by Si ion, annealing after implanted respectively are studied by electron spin resonance (ESR). The results show that the intrinsic defects in Si ion implanted and annealing are the same as that as-grown 4H-SiC consist of carbon vacancy (Vc) and complex-compounds-related Vc, which is to say Si ion implanted and annealing treatment have a few effects on the intrinsic defects in unintentionally doped 4H-SiC prepared by low pressure chemical vapor deposition. The ESR spectrum are the same as that as-grown samples with Xe light, which are illumination time changes the relative density of intrinsic defects in 4H-SiC; the relative density of intrinsic defects reaches a maximum when the illumination time is 2.5 min, and the ratio of Vc to complex compounds is minimized simultaneously. It can be deduced that some Vsi may be transformed to the complex-compounds-related Vc because of the illumination.
Keywords :
annealing; density; ion implantation; paramagnetic resonance; semiconductor doping; semiconductor epitaxial layers; silicon; silicon compounds; vacancies (crystal); wide band gap semiconductors; ESR character; ESR spectrum; SiC:Si; annealing treatment; complex-compound-related carbon vacancy; electron spin resonance character; epitaxial semiinsulator; intrinsic defect; low pressure chemical vapor deposition; relative density; time 2.5 min; Annealing; Epitaxial growth; Lighting; Silicon; Silicon carbide; Substrates; Xenon; electron spin resonance; intrinsic defects; low pressure chemical vapor deposition; semi-insulating 4H-SiC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location :
Harbin, Heilongjiang, China
Print_ISBN :
978-1-61284-087-1
Type :
conf
DOI :
10.1109/EMEIT.2011.6023341
Filename :
6023341
Link To Document :
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