Title :
Session 6 - Advanced SoC/SiP integration & co-design
Author :
Liu, Rich ; Jansen, Philippe
Author_Institution :
Macronix International Co., Ltd., USA
Abstract :
Higher level system integration to achieve better performance and lower cost has consistently driven new technologies. The solutions are no longer just monolithic; in some cases the best solution involves innovative new packaging approaches and in others on-chip integration of different technologies. This session presents several approaches that may best solve particular application challenges.
Conference_Titel :
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2018-6
DOI :
10.1109/CICC.2008.4672023
