• DocumentCode
    3359690
  • Title

    Modeling of triple-well isolation and the loading effects on circuits up to 50 GHz

  • Author

    Park, Piljae ; Yue, C. Patrick

  • Author_Institution
    High-Speed Silicon Lab., Univ. of California, Santa Barbara, CA
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    217
  • Lastpage
    220
  • Abstract
    This paper presents the noise isolation characteristics and substrate loading effects of NMOS devices in triple-well (TW) at frequencies up to 50 GHz. The importance of the series resistance in well bias path is investigated. Our study reveals that using large well bias resistors, which create a high substrate impedance, are beneficial to circuit performance in both saturation and triode bias regimes. However, small bias resistances are advantageous for better substrate noise isolation. By using test circuits designed in a 0.13-mum CMOS technology, a compact model for TW substrate impedance is developed to facilitate quantitative analyses. The dependence of TW isolation effectiveness on the bias resistance, well capacitance, and noise frequency are evaluated. To measure the impact of TW on circuit performances, the output impedance of a saturation-mode device and the insertion loss (IL) between source and drain of a triode-mode device are examined under different biasing conditions.
  • Keywords
    CMOS integrated circuits; interference suppression; resistors; CMOS technology; NMOS devices; TW substrate impedance; bias resistance; insertion loss; noise frequency; noise isolation characteristics; saturation-mode device; series resistance; substrate loading effects; triode-mode device; triple-well isolation; well capacitance; CMOS technology; Circuit noise; Circuit optimization; Circuit testing; Frequency; Impedance; Isolation technology; MOS devices; Resistors; Semiconductor device modeling; Substrate noise isolation; Triple-well bias; Triple-well model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2018-6
  • Electronic_ISBN
    978-1-4244-2019-3
  • Type

    conf

  • DOI
    10.1109/CICC.2008.4672062
  • Filename
    4672062