DocumentCode
3359871
Title
Lateral SOI diode design optimization for high ruggedness and low temperature dependence of reverse recovery characteristics
Author
Funaki, Hideyuki ; Yamaguchi, Yoshihiro ; Hirayama, Keizo ; Nakagawa, Akio
Author_Institution
Toshiba Corp., Kawasaki, Japan
fYear
1998
fDate
3-6 Jun 1998
Firstpage
33
Lastpage
36
Abstract
This paper compares, for the first time, the maximum controllable current, or SOA of three different diode structures with low efficiency emitters. Low anode emitter efficiency is achieved either by introducing n+ diffusions in the p-type anode region (n+/p+ diodes), or by adopting a low surface concentration anode (p-/p+ diodes), or by shallow p diffusion (shallow p/p+ diodes). It was found that the n +/p+ diode was easily destroyed in the reverse recovery transient at a high temperature of 150°C because of a parasitic n-p-n transistor action. The best optimization was found in p -/p+ diodes. Shallow p/p+ diodes exhibited the same ruggedness, if the dose of the shallow p layer was optimized
Keywords
diffusion; doping profiles; optimisation; power semiconductor diodes; semiconductor device testing; silicon-on-insulator; transient analysis; transient response; 150 C; Si-SiO2; anode emitter efficiency; diode SOA; diode ruggedness; diode structures; lateral SOI diode design optimization; low efficiency emitters; low surface concentration anode; low temperature dependence; maximum controllable current; n+ diffusions; n+/p+ diode destruction; n+/p+ diodes; optimization; p-type anode region; p-/p+ diodes; parasitic n-p-n transistor action; reverse recovery characteristics; reverse recovery transient; shallow p diffusion; shallow p layer dose optimization; shallow p/p+ diodes; Anodes; Cathodes; Design optimization; Electric variables; Ohmic contacts; Schottky diodes; Semiconductor devices; Semiconductor diodes; Temperature dependence; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
Conference_Location
Kyoto
ISSN
1063-6854
Print_ISBN
0-7803-4752-8
Type
conf
DOI
10.1109/ISPSD.1998.702623
Filename
702623
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