IRDrop analysis in power delivery network design

This paper introduces a process that allows customers to do IRDrop analysis on the package/SiP and PCB level. The component information such as the package model, power consumption and voltage regulator module (VRM) as well as power delivery network circuit can be used at the package and board level to perform static IRDrop analysis. The power consumption is used to obtain the current excitation while the VRM pins are used to provide the power supply. For the complicated package and PCB geometry structure, the progressive mesh scheme is used to extract the DC circuit model for their power delivery network. In order to meet the tolerance of current and voltage drop, the required VRM and IC components locations as well as stackup can be optimized according to the voltage drop in DC domain. The user can also view the voltage drop, current and temperature rise.