Title :
Computational electromagnetics for multi-scale structures in circuits
Author :
Chew, W.C. ; Qian, Z.G. ; Li, M.K.
Author_Institution :
Univ. of Hong Kong, Hong Kong, China
Abstract :
This presentation summarizes some recent advances of computational electromagnetics for complex structures encountered in circuits. The results are applied for multi-scale computations encountered in computer circuits and packaging.
Keywords :
computational electromagnetics; electromagnetic interference; packaging; computational electromagnetics; computer circuits; multiscale structures; packaging; Circuits; Computational electromagnetics; Computational fluid dynamics; Differential equations; Electronics packaging; Frequency; Integral equations; Matrix decomposition; Physics computing; USA Councils;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5403977
