DocumentCode
3359970
Title
Signal integrity analysis of high speed USB IO and interconnection
Author
Chen, Tinghou ; Luo, Pinghua ; Fu, Huili
Author_Institution
Bantian Longgang Base, Huawei Technol. (Hisilicon) Co Ltd., Shenzhen, China
fYear
2009
fDate
2-4 Dec. 2009
Firstpage
1
Lastpage
5
Abstract
This paper analyzed the signal integrity of high speed USB IO and IC package. Time domain modeling and measurement were studied and compared. The effect of the die junction temperature and the effect of process variations (typical and worst process parameters) were studied. Through the time domain signal integrity analysis, high signal quality and low cost design of high speed USB IO, package and PCB can be implemented.
Keywords
integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; IC interconnection; IC package; PCB; high speed USB IO; time domain measurement; time domain modeling; time domain signal integrity analysis; Signal analysis; Universal Serial Bus;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location
Shatin, Hong Kong
Print_ISBN
978-1-4244-5350-4
Electronic_ISBN
978-1-4244-5351-1
Type
conf
DOI
10.1109/EDAPS.2009.5403980
Filename
5403980
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