• DocumentCode
    336004
  • Title

    Spatial inhomogeneity and regularization in EIT

  • Author

    Kolehmainen, V. ; Vauhkonen, M. ; Karjalainen, P.A. ; Kaipio, J.P.

  • Author_Institution
    Dept. of Appl. Phys., Kuopio Univ., Finland
  • Volume
    1
  • fYear
    1997
  • fDate
    30 Oct-2 Nov 1997
  • Firstpage
    449
  • Abstract
    The reconstruction of impedance distribution in electrical impedance tomography (EIT) is a nonlinear ill-posed inverse problem. In order to obtain a stable solution the problem has to be regularized. One of the most common methods for this is the generalized Tikhonov regularization. The regularization matrices that are usually used with the Tikhonov method are more or less ad hoc and the associated implicit assumptions are thus in many cases inappropriate. Here, the authors propose a method with which the prior assumptions on the approximately known spatial inhomogeneity of the impedance distribution can be included in the regularization. The proposed approach is shown to be suitable in the cases in which there are distinct and known jumps in the impedance distribution. Such an example is the imaging of the head in which there are large impedance changes in the scalp-skull and skull-brain interfaces
  • Keywords
    electric impedance imaging; image reconstruction; inverse problems; medical image processing; electrical impedance tomography; generalized Tikhonov regularization; head imaging; impedance distribution jumps; impedance distribution reconstruction; implicit assumptions; medical diagnostic imaging; nonlinear ill-posed inverse problem; prior assumptions; regularization matrices; scalp-skull interface; skull-brain interface; stable solution; Conductivity; Electrodes; Head; Image reconstruction; Inverse problems; Jacobian matrices; Physics; Surface impedance; Surface reconstruction; Tomography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.754576
  • Filename
    754576