DocumentCode :
3360130
Title :
Experiment and simulation of power supply switching current dependency on on-chip capacitance
Author :
Hoshino, Kozo ; Satomi, Ryuki ; Sudo, Toshio ; Okano, Hirokazu ; Ishikawa, Miyuki ; Shibayama, Hiroyuki ; Aoyagi, Hiroshi ; Kushibe, Hidefumi ; Yamagishi, Kunihiko
Author_Institution :
Shibaura Inst. of Technol., Tokyo, Japan
fYear :
2009
fDate :
2-4 Dec. 2009
Firstpage :
1
Lastpage :
4
Abstract :
Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.
Keywords :
CMOS integrated circuits; distribution networks; interference suppression; large scale integration; power supply circuits; CMOS test chip; I/O circuits; MOS capacitor cells; automotive; core circuits; electromagnetic interference; ground conductors; high-performance CMOS LSIs; meshed power; mobile communication; on-chip capacitance; on-chip decoupling capacitors; power distribution network; power supply switching current dependency; switching noise; test element groups; Capacitance; Circuits; Communication switching; Current supplies; Electromagnetic interference; Large scale integration; MOS capacitors; Power supplies; Power systems; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
Type :
conf
DOI :
10.1109/EDAPS.2009.5403989
Filename :
5403989
Link To Document :
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