• DocumentCode
    3360281
  • Title

    A novel on-chip fractal power tree network based on leaf vein grids

  • Author

    Huang, HuiFen ; Chu, QingXin ; Xiao, JianKang

  • Author_Institution
    Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2009
  • fDate
    2-4 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and ¿Swiss Cheese¿ effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit - elements lower than design demand).
  • Keywords
    circuit simulation; electric potential; fractals; isolation technology; network-on-chip; power supply circuits; trees (mathematics); Swiss cheese effect; fractal structure; inductive voltage drop; leaf vein grids; noise isolation; on-chip fractal power tree network; resistive voltage drop; Circuit noise; Dairy products; Fractals; Network-on-a-chip; Periodic structures; Power engineering and energy; Power grids; Tree data structures; Veins; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
  • Conference_Location
    Shatin, Hong Kong
  • Print_ISBN
    978-1-4244-5350-4
  • Electronic_ISBN
    978-1-4244-5351-1
  • Type

    conf

  • DOI
    10.1109/EDAPS.2009.5403999
  • Filename
    5403999