Title :
A novel on-chip fractal power tree network based on leaf vein grids
Author :
Huang, HuiFen ; Chu, QingXin ; Xiao, JianKang
Author_Institution :
Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
Abstract :
In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and ¿Swiss Cheese¿ effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit - elements lower than design demand).
Keywords :
circuit simulation; electric potential; fractals; isolation technology; network-on-chip; power supply circuits; trees (mathematics); Swiss cheese effect; fractal structure; inductive voltage drop; leaf vein grids; noise isolation; on-chip fractal power tree network; resistive voltage drop; Circuit noise; Dairy products; Fractals; Network-on-a-chip; Periodic structures; Power engineering and energy; Power grids; Tree data structures; Veins; Voltage;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5403999
