Title :
Filter integration in ultra thin organic substrate via 3D stitched capacitor
Author :
Min, Sunghwan ; Hwang, Seunghyun ; Chung, Daehyun ; Swaminathan, Madhavan ; Sridharan, Vivek ; Chan, Hunter ; Liu, Fuhan ; Sundaram, Venky ; Tummala, Rao R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2 dB, return loss of greater than 15 dB at 2.4 GHz and attenuation of greater than 30 dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2 mm × 3.0 mm × 0.2 mm (1.2 mm3) in ultra thin organic RXP substrate.
Keywords :
ceramic capacitors; printed circuit manufacture; substrates; system-on-package; 3D stitched capacitor; bandpass filters; filter integration; frequency 2.4 GHz; frequency 4.7 GHz; ultra thin organic substrate; Capacitors; Dielectric materials; Dielectric substrates; Electronics packaging; Filters; Magnetic materials; Radio frequency; Semiconductor device packaging; Temperature; Wireless communication;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5404004
