DocumentCode :
3360564
Title :
Surface modification and organic film removal using atmospheric pressure pulsed corona plasma
Author :
Yamamoto, Toshiaki ; Newsome, Randy ; Ensor, David S.
Author_Institution :
Res. Triangle Inst., Research Triangle Park, NC, USA
fYear :
1992
fDate :
4-9 Oct. 1992
Firstpage :
1428
Abstract :
A laboratory-scale atmospheric pressure plasma reactor, using a nanosecond pulsed corona, was constructed to demonstrate potential applications, ranging from modification of surface energy to removal of surface organic films. For surface modification studies three different substrates were selected to evaluate the surface energies: bare aluminum, polyurethane, and silicon coated with photoresist. The critical surface energy for all materials studied was significantly increased after the plasma treatment. The effects of gas composition and plasma treatment time were also investigated. Photoresist, ethylene glycol and Micro surfactant were used as test organic films. The etching rate of a photoresist coating on silicon was 9 nm/min. Organic film removal using atmospheric pressure plasma technology was shown to be feasible.<>
Keywords :
corona; etching; photoresists; plasma applications; surface treatment; Micro surfactant; applications; atmospheric pressure pulsed corona plasma; etching rate; ethylene glycol; gas composition; organic film removal; photoresist; plasma treatment; surface energy; surface treatment; Atmospheric-pressure plasmas; Corona; Inductors; Laboratories; Plasma applications; Plasma materials processing; Resists; Silicon; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting, 1992., Conference Record of the 1992 IEEE
Conference_Location :
Houston, TX, USA
Print_ISBN :
0-7803-0635-X
Type :
conf
DOI :
10.1109/IAS.1992.244250
Filename :
244250
Link To Document :
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