Title :
Signal quality test with 3-Dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)
Author :
Yoon, Changwook ; Kim, Jiseong ; Kim, Joungho
Author_Institution :
Dept. of EECS, KAIST, Daejeon, South Korea
Abstract :
This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in ultra wide-band (UWB) transceiver which is designed by system-in-package (SiP) technology for wireless mobile application. 3-dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.
Keywords :
mobile radio; system-in-package; transceivers; ultra wideband communication; 3-dimensional BER; RZ modulated digital signal; UWB transceiver; noise immunity; noise susceptibility; noncoherent ultra wideband system-in-package; signal quality test; wireless mobile application; Bit error rate; Circuits; Digital modulation; Noise level; Pulse modulation; Signal design; System testing; Timing; Transceivers; Ultra wideband technology;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5404017
