Signal quality test with 3-Dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)

Author

Yoon, Changwook ; Kim, Jiseong ; Kim, Joungho

Author_Institution

Dept. of EECS, KAIST, Daejeon, South Korea

fYear

2009

fDate

2-4 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in ultra wide-band (UWB) transceiver which is designed by system-in-package (SiP) technology for wireless mobile application. 3-dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.

Keywords

mobile radio; system-in-package; transceivers; ultra wideband communication; 3-dimensional BER; RZ modulated digital signal; UWB transceiver; noise immunity; noise susceptibility; noncoherent ultra wideband system-in-package; signal quality test; wireless mobile application; Bit error rate; Circuits; Digital modulation; Noise level; Pulse modulation; Signal design; System testing; Timing; Transceivers; Ultra wideband technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Conference_Location

Shatin, Hong Kong

Print_ISBN

978-1-4244-5350-4

Electronic_ISBN

978-1-4244-5351-1

Type

conf

DOI

10.1109/EDAPS.2009.5404017

Filename

5404017