3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion

Author

Hsiao, Fu-Sheng ; Chao, Jen-Ai ; Huang, Yi-Cheng

Author_Institution

Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan

fYear

2009

fDate

9-12 Aug. 2009

Firstpage

158

Lastpage

163

Abstract

Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer´s tip motion behavior for future study.

Keywords

Doppler effect; bonding processes; finite element analysis; packaging; piezoelectric transducers; ultrasonic transducers; vibrations; 3D ATILA software; 3D finite element analysis; LCR impedance meter; bonding process; displacement motion; laser Doppler velocity meter; mechanical vibration; package technology; piezoelectric ultrasonic transducer motion; resonance frequency; Bonding processes; Finite element methods; Motion analysis; Packaging; Performance analysis; Piezoelectric transducers; Resonance; Resonant frequency; Ultrasonic transducers; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Mechatronics and Automation, 2009. ICMA 2009. International Conference on

Conference_Location

Changchun

Print_ISBN

978-1-4244-2692-8

Electronic_ISBN

978-1-4244-2693-5

Type

conf

DOI

10.1109/ICMA.2009.5246089

Filename

5246089