On application of multicomponent copper alloys for making microstrip line conductors of EHF microcircuits

Author

Bessonov, V.A. ; Barantsev, S.A. ; Uliyanova, L.L.

Author_Institution

Sci. Res. Technol. Inst. of Instrum. Eng., Kharkov, Ukraine

Volume

2

fYear

1998

fDate

15-17 Sep 1998

Firstpage

636

Abstract

The purpose of our work is to develop new compositions for copper alloys in order to reduce electromagnetic energy losses in microstrip lines providing invariability of a high conductor adhesion to an insulator substrate, fine weldability and solderability of these microstrip lines. It is proposed to use the multicomponent fractionatable copper alloys Cu-Mg-Cr-Ti and Cu-Mg-Ge-Sn during thermal evaporation where the “gradient” films with required parameters are being formed

Keywords

adhesion; chromium alloys; copper alloys; germanium alloys; losses; magnesium alloys; microstrip lines; millimetre wave integrated circuits; soldering; tin alloys; titanium alloys; vapour deposition; CuMgCrTi; CuMgGeSn; EHF microcircuits; conductor adhesion; electromagnetic energy losses; fractionatable alloys; gradient films; microstrip line conductors; multicomponent alloys; solderability; thermal evaporation; weldability; Adhesives; Conducting materials; Conductors; Copper alloys; Energy loss; Microstrip components; Microstrip resonators; Q factor; Substrates; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Physics and Engineering of Millimeter and Submillimeter Waves, 1998. MSMW '98. Third International Kharkov Symposium

Conference_Location

Kharkov

Print_ISBN

0-7803-5553-9

Type

conf

DOI

10.1109/MSMW.1998.755543

Filename

755543