Title :
Technique to Detect RF Interface and Contact Issues During Production Testing
Author_Institution :
Teradyne, Munich
Abstract :
Most of today´s production programs do not use automatic tests for RF pins to ensure proper coaxial cable interfacing, matching functionality and board to device contact. This paper will describe a test technique that uses s-parameter measurements and time domain reflectometry (TDR) to quickly locate interface issues
Keywords :
S-parameters; automatic test equipment; integrated circuit testing; production testing; time-domain reflectometry; RF interface; automatic tests; coaxial cable interfacing; contact issues; interface issues; matching functionality; production testing; s-parameter measurements; time domain reflectometry; Automatic testing; Coaxial cables; Digital signal processing; Performance evaluation; Pins; Production; Radio frequency; Reflectometry; Scattering parameters; System testing;
Conference_Titel :
Test Conference, 2006. ITC '06. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
1-4244-0292-1
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2006.297703
