Title :
Implementation of Solder-bead Probing in High Volume Manufacturing
Author :
Doraiswamy, Madhavan ; Grealish, James
Author_Institution :
Intel Corp., Hillsboro, OR
Abstract :
Solder-bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards. It is a promising complement to traditional probing solutions, because test access points are placed directly on board traces, thus addressing shrinking board real estate without compromising test quality. This paper summarizes the design, manufacturing, and test parameters Intel will use to implement the technology in a high volume manufacturing environment
Keywords :
printed circuit manufacture; printed circuit testing; soldering; solders; Intel; high volume manufacturing; printed circuit boards; solder-bead probing; test quality; Circuit testing; Copper; Degradation; Fixtures; Frequency; Manufacturing industries; Printed circuits; Probes; Pulp manufacturing; Signal analysis;
Conference_Titel :
Test Conference, 2006. ITC '06. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
1-4244-0292-1
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2006.297710
