DocumentCode
3360946
Title
Implementation of Solder-bead Probing in High Volume Manufacturing
Author
Doraiswamy, Madhavan ; Grealish, James
Author_Institution
Intel Corp., Hillsboro, OR
fYear
2006
fDate
Oct. 2006
Firstpage
1
Lastpage
10
Abstract
Solder-bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards. It is a promising complement to traditional probing solutions, because test access points are placed directly on board traces, thus addressing shrinking board real estate without compromising test quality. This paper summarizes the design, manufacturing, and test parameters Intel will use to implement the technology in a high volume manufacturing environment
Keywords
printed circuit manufacture; printed circuit testing; soldering; solders; Intel; high volume manufacturing; printed circuit boards; solder-bead probing; test quality; Circuit testing; Copper; Degradation; Fixtures; Frequency; Manufacturing industries; Printed circuits; Probes; Pulp manufacturing; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297710
Filename
4079388
Link To Document