Title :
Application and simulation of liquid-quenched fuses in hybrid opening switches
Author_Institution :
Propulsion Phys. Lab., Soreq NRC, Yavne, Israel
fDate :
June 29 1997-July 2 1997
Abstract :
For the experimental investigation of high current high voltage fuses (HVF), a two-stage opening switch was designed and tested. It comprises of a vacuum circuit breaker serving as a first stage and an HVF in series with an SCR as a second stage. The switch offers a low resistance of 20 /spl mu//spl Omega/ during charge intervals of several hundred milliseconds, controlled time to opening and a relatively fast opening of 0.25-0.7 ms. In a series of experiments, the current of 30-40 kA was commutated routinely from a 130 /spl mu/H inductor into the resistive load at a voltage of 3 kV. Liquid quenching media were examined and found to yield a high transfer efficiency, with fuse losses as low as 5-8% of the stored energy. A strong correlation existing between these parameters and the pressure generated in the fuse is discussed. A semi-analytical engineering fuse model based on an electron-ion recombination mechanism of the fuse resistance change is developed. This model is integrated into a PSpice circuit simulation. The calculations are in fairly good qualitative and quantitative agreement with experimental results.
Keywords :
SPICE; circuit breakers; electric fuses; electric resistance; losses; pulsed power switches; 0.25 to 0.7 ms; 20 muohm; 3 kV; 30 to 40 kA; PSpice circuit simulation; SCR; controlled time to opening; electron-ion recombination mechanism; fuse losses; high current high voltage fuses; high transfer efficiency; hybrid opening switches; liquid-quenched fuses; low resistance; relatively fast opening; semi-analytical engineering fuse model; two-stage opening switch; vacuum circuit breaker; Circuit breakers; Circuit simulation; Circuit testing; Fuses; Inductors; Power engineering and energy; Spontaneous emission; Switches; Thyristors; Voltage;
Conference_Titel :
Pulsed Power Conference, 1997. Digest of Technical Papers. 1997 11th IEEE International
Conference_Location :
Baltimore, MA, USA
Print_ISBN :
0-7803-4213-5
DOI :
10.1109/PPC.1997.674559