Cooling management of a protruding electronic components by using a phase change material heat sink

Author

Faraji, Mustapha ; EL Qarnia, Hamid

Author_Institution

Univ. Cadi Ayyad, Marrakech

fYear

2007

fDate

11-14 Dec. 2007

Firstpage

174

Lastpage

177

Abstract

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.

Keywords

cooling; heat sinks; phase change materials; semiconductor device packaging; thermal conductivity; thermal management (packaging); cooling management; heat sink; mathematical model; phase change material; protruding electronic component; protruding substrate-mounted electronic chips; substrate thermal conductivity; thermal performance; Analytical models; Electronic components; Electronics cooling; Heat sinks; Mathematical model; Phase change materials; Power generation; Thermal conductivity; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on

Conference_Location

Marrakech

Print_ISBN

978-1-4244-1377-5

Electronic_ISBN

978-1-4244-1378-2

Type

conf

DOI

10.1109/ICECS.2007.4510958

Filename

4510958