Title :
Cooling management of a protruding electronic components by using a phase change material heat sink
Author :
Faraji, Mustapha ; EL Qarnia, Hamid
Author_Institution :
Univ. Cadi Ayyad, Marrakech
Abstract :
The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.
Keywords :
cooling; heat sinks; phase change materials; semiconductor device packaging; thermal conductivity; thermal management (packaging); cooling management; heat sink; mathematical model; phase change material; protruding electronic component; protruding substrate-mounted electronic chips; substrate thermal conductivity; thermal performance; Analytical models; Electronic components; Electronics cooling; Heat sinks; Mathematical model; Phase change materials; Power generation; Thermal conductivity; Thermal management; Thermal management of electronics;
Conference_Titel :
Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on
Conference_Location :
Marrakech
Print_ISBN :
978-1-4244-1377-5
Electronic_ISBN :
978-1-4244-1378-2
DOI :
10.1109/ICECS.2007.4510958
