DocumentCode
3361871
Title
High-Speed I/O Tests in High-Volume Manufacturing
Author
Swing, Brian
Author_Institution
Teradyne, Inc., 1321 Ridder Park Dr., San Jose, CA 95131. brian.swing@teradyne.com
fYear
2006
fDate
Oct. 2006
Firstpage
1
Lastpage
2
Abstract
As high speed IO buses increase in number on emerging devices, new test challenges will drive changes in tester configuration and performance. HVM Tester pin capabilities will shift away from pure digital test to include coverage for high speed functional, AC characterization, and performance based tests. Production test economics will challenge these solutions to be provided at low cost with test time efficiency for large pin count configurations.
Keywords
Clocks; Costs; Frequency measurement; Jitter; Manufacturing; Phase measurement; Production; Testing; Time measurement; Transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA, USA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297764
Filename
4079442
Link To Document