High-Speed I/O Tests in High-Volume Manufacturing: What is Necessary? What is Sufficient?

Author

Tripp, Mike

Author_Institution

Intel Corp., Santa Clara, CA

fYear

2006

fDate

Oct. 2006

Firstpage

1

Lastpage

2

Abstract

Intel Corporation has successfully used DFT and self test methods to enable high volume manufacturing (HVM) of devices with both bidirectional and unidirectional interfaces operating between 1 Gb/s and 2.5 Gb/s on ATE with native data rates of 667 Mb/s or below. Extensions have developed and demonstrated in lab on interfaces up to 20Gb/s. While we continue to rely on full speed functional testing for some of our content we are not driving for ATE that would be capable of the accuracy needed to "measure" the interface performance parameters directly. Can you guess my position?

Keywords

automatic test equipment; automatic testing; design for testability; integrated circuit manufacture; integrated circuit testing; production testing; 1 to 2.5 Gbit/s; 20 Gbit/s; 667 Mbits/s; automatic test equipment; design for testability; functional testing; high volume manufacturing; self testing; Automatic testing; Circuit testing; Costs; Design for testability; Manufacturing; Relays; Robustness; Semiconductor device measurement; Sockets; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2006. ITC '06. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

1-4244-0292-1

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2006.297765

Filename

4079443