Title :
An overview of smart conductive adhesive
Author :
Niagu, A. ; Scarlatache, V. ; Ursache, Silviu ; Moraru, G.M.
Author_Institution :
Fac. of Electr. Eng., Dept. of Electr. Meas. & Mater., "Gheorghe Asachi" Tech. Univ. of Iasi, Iasi, Romania
Abstract :
In this article it is presented an introduction in smart conductive adhesive joining technology, a classification of the adhesive, and some generalities about the fields of application and the bonding at microscopic level.
Keywords :
adhesive bonding; conductive adhesives; bonding; smart conductive adhesive joining technology; Adhesive; bonding; resigns; thermoplast; thermoset;
Conference_Titel :
Electrical and Power Engineering (EPE), 2012 International Conference and Exposition on
Conference_Location :
Iasi
Print_ISBN :
978-1-4673-1173-1
DOI :
10.1109/ICEPE.2012.6463946
