• DocumentCode
    3361908
  • Title

    An overview of smart conductive adhesive

  • Author

    Niagu, A. ; Scarlatache, V. ; Ursache, Silviu ; Moraru, G.M.

  • Author_Institution
    Fac. of Electr. Eng., Dept. of Electr. Meas. & Mater., "Gheorghe Asachi" Tech. Univ. of Iasi, Iasi, Romania
  • fYear
    2012
  • fDate
    25-27 Oct. 2012
  • Firstpage
    88
  • Lastpage
    93
  • Abstract
    In this article it is presented an introduction in smart conductive adhesive joining technology, a classification of the adhesive, and some generalities about the fields of application and the bonding at microscopic level.
  • Keywords
    adhesive bonding; conductive adhesives; bonding; smart conductive adhesive joining technology; Adhesive; bonding; resigns; thermoplast; thermoset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Power Engineering (EPE), 2012 International Conference and Exposition on
  • Conference_Location
    Iasi
  • Print_ISBN
    978-1-4673-1173-1
  • Type

    conf

  • DOI
    10.1109/ICEPE.2012.6463946
  • Filename
    6463946
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3361908